Tessolve, which started as a semiconductor test services provider, now offers a range of chip design, systems engineering, and test services. Tessolve received a $40.0M private equity investment from Novo Tellus Capital Partners. Based in Shanghai, China, the company was founded in 2019. The company said it has also received backing from Crossbar Asia Pacific, Kleiner Perkins Caufield & Byers, Lam Research, SAIF Partners China, Northern Light Venture Capital, CBC Capital, and Oriza Ventures. “We hope that we can design new generation memory chip products and improve storage technology, as well as advance ecosystem in partnerships with semiconductor designers and manufacturers,” said Innostar founder and CEO Xiang Zhang. The company will use the funding for development of resistive RAM (ReRAM) and storage chips. Memory startup Innostar Semiconductor raised $100.0M in a pre-Series A round led by Shanghai Lianhe Investment and joined by New Alliance as well as new investors Atlas Capital and KQ Capital. It is reportedly preparing to list on the Shanghai STAR market later this year. Formerly known as Spreadtrum before its acquisition by Tsinghua Unigroup, Unisoc is based in Shanghai, China.
It is currently working with Xiaomi and OPPO on a sub-6GHz 5G chip. The fabless company designs a range of chipsets for mobile and IoT/IIoT applications, including 5G mobile and baseband as well as NB-IoT. Unisoc raised CNY 5.4B (~$814.6M) in new funding, with Guosheng Capital, Country Garden Venture Capital, Haier Financial, and W&W Fund among the participants. This month, we take a look at 22 companies that collectively raised over $2.3B. Plus, a major test and design services company drew new investment. In the US, AI hardware startups are drawing interest with unique processor architectures and business models. In China, a mobile chipset maker looking to go public won significant funding along with partnerships with major smartphone companies.
April showers brought mega fundraising rounds to the semiconductor industry.
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